April 2010
Volume 51, Issue 13
Free
ARVO Annual Meeting Abstract  |   April 2010
High Density Bonding to Next Generation Hermetic Packaging for the Boston Retinal Prosthesis
Author Affiliations & Notes
  • D. B. Shire
    VA Medical Center, Ctr for Innovative Visual Rehabilitation, Boston, Massachusetts
    Cornell Nanofabrication Facility, CNF, Ithaca, New York
  • T. Salzer
    Hermetric, Inc., Bedford, Massachusetts
  • W. K. Jones
    Advanced Materials Engineering Research Institute, Florida International University, Miami, Florida
  • R. Akhmechet
    Cornell Nanofabrication Facility, CNF, Ithaca, New York
    Neuro-Ophthalmology, Massachusetts Eye and Ear Infirmary, Boston, Massachusetts
  • M. D. Gingerich
    VA Medical Center, Ctr for Innovative Visual Rehabilitation, Boston, Massachusetts
    Cornell Nanofabrication Facility, CNF, Ithaca, New York
  • J. L. Wyatt
    Electrical Engineering, Massachusetts Institute of Technology, Cambridge, Massachusetts
  • J. F. Rizzo
    Neuro-Ophthalmology, Massachusetts Eye and Ear Infirmary, Boston, Massachusetts
    Center for Innovative Visual Rehabilitation, VA Medical Center, Boston, Massachusetts
  • Footnotes
    Commercial Relationships  D.B. Shire, US Patent #6324429, P; T. Salzer, Hermetric, Inc., I; US Patent #6520399, P; W.K. Jones, Advanced Materials Engineering Research Institute, I; US Patent #4616655, P; R. Akhmechet, US Patent #6324429, P; M.D. Gingerich, US Patent #6324429, P; J.L. Wyatt, US Patent #6324429, P; J.F. Rizzo, US Patent #6324429, P.
  • Footnotes
    Support  NSF IIS-0515134, CNF Facility; VA CIVR; NIH EY016674-01
Investigative Ophthalmology & Visual Science April 2010, Vol.51, 3037. doi:
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      D. B. Shire, T. Salzer, W. K. Jones, R. Akhmechet, M. D. Gingerich, J. L. Wyatt, J. F. Rizzo; High Density Bonding to Next Generation Hermetic Packaging for the Boston Retinal Prosthesis. Invest. Ophthalmol. Vis. Sci. 2010;51(13):3037.

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Abstract
 
Purpose:
 

This work is related to the efforts of the Boston Retinal Implant Project to develop a sub-retinal prosthesis to restore vision to the blind.

 
Methods:
 

Custom polyimide arrays with 69 Au micro-contacts, each 200 microns in diameter, were microfabricated and the contacts electroplated to a thickness of 40 microns. Meanwhile, screened and sintered Pt and Au bumps were patterned on 96% alumina substrates to match the contact pattern. Samples were joined together using a Kulicke & Soffa model 4522 bonder in TAB mode with the substrate heater set at 150 degrees C. Thermo-compression joints were made using a Small Precision Tools SPT 7645A-TI-0040-S-M tip.

 
Results:
 

Bond shear tests to the trial retinal implant feedthrough assemblies were performed using a XYZTec Condor 70 shear force tester. The thermo-compression bonds withstood up to 50 grams of force, indicating good quality bonding. Au to Au joining required less force and time than Au to Pt bonding. Optimization of the profiles of the electroplated contact pads and the sintered bumps on the electrode arrays and feedthrough discs respectively is expected to yield even greater bond strength. Polyimide mesh-reinforced contact pads were found to improve the integrity of the electrode array-feedthrough connections (see photo below).

 
Conclusions:
 

The feasibility of high-density bonding of microfabricated electrode arrays to hermetic signal feedthrough arrays having 69 channels has been demonstrated. Such structures will form a key component in the next-generation Boston retinal prosthesis.  

 
Keywords: retinal degenerations: hereditary • age-related macular degeneration • retina 
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